The Future of Electronics RESHAPED - Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, Wearable, Structural, and 3D. Join the flagship TechBlick event in Berlin on 21–22 October 2026 — where each year more than 600 participants from across the globe come together to RESHAPE the Future of Electronics, making it additive, sustainable, 3D, roll-to-roll, flexible, hybrid, soft, stretchable, and wearable.
This event is the global home of the Additive, Printed, Sustainable, Flexible, Hybrid, Soft, Wearable and 3D Electronics. It is here that each year the latest innovations are unveiled, the key conversations take place, and new ideas, projects, and products are forged.
We invite all engineers, researchers, inventors, manufacturers and end users from around the world to join us to enjoy a curated world-class agenda and masterclass program with four parallel tracks (over 100 speakers), to experience and feel the latest technologies at a vibrant tabletop exhibition showcasing 90+ global exhibitors, and to connect with over 600 peers, customers and partners from around the world.
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