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TechBlick USA - Electronics RESHAPED 2026

Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid, Wearable, Textile, Structural, R2R, and 3D. Due to overwhelming demand, we are moving the third edition of this growing event to California.

Date
10th - 11th Jun 2026
Location
USA
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The Future of Electronics RESHAPED conference and exhibition is where the global Additive, Sustainable, Hybrid and 3D Electronics industry connects. It is the largest and the most important conference and exhibition ​in North America ​for this industry. The 2025 event was a sell-out.

Enjoy a curated world-class agenda and masterclass program with three parallel tracks, experience and feel the latest technologies at a tabletop​ exhibition showcasing global exhibitors, and connect with customers and partners from around the world.

This event is the global home of the Additive, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest ​innovations are unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed!

 

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Textile 2026

Location
Spain
Date
19th - 22nd May 2026

Powering the Future of Printed Textiles, Apparel & Décor - Textile From FESPA. The new Textile event builds on FESPA’s long heritage in screen and digital…

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Corrugated 2026

Location
Spain
Date
19th - 22nd May 2026

A machinery and supplier conference and exhibition for corrugated converters - Coming to Fira Barcelona, 19-22 May 2026, Corrugated (joint venture with…

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SPI Screen Print Innovations 2027

Location
Germany
Date
15th - 17th Jun 2027

After the resounding success of its inaugural edition in 2025, Screen Print Innovations (SPI) will return to Messe Essen, Hall 8, on 15–17 June 2027.…

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